Semiconductor packaging refers to the process of processing individual chips according to the product model and functional requirements from wafers that have passed the test. The packaging process cuts the wafer from: wafer process into small wafers through a stroke process, and then attaches the cut wafer as an adhesive to the island of the substrate (lead frame) frame, and then uses ultra-fine metal (gold stone copper aluminum) wire or conductive resin to which the wafer's solder pads are attached. Then the independent chip is packaged into a plastic shell, and a series of operations are carried out after the plastic is completed. After the packaging is completed, the finished product is tested. Generally, the process of vocoding, testing, packaging and other processes is finally put into storage and shipped.

　　What is the role of semiconductor packaging?

　　Semiconductor packaging is necessary for chips and is very important. The package is the shell used to install the semiconductor integrated circuit chip, which not only plays the role of protecting the chip and improving the thermal conductivity, but also plays the common function of the bridge and specification of the internal world of the communication chip and the external circuit. The main functions of semiconductor packaging are as follows：

　　(1) Physical protection. Because the chip must be isolated from the outside world to prevent the impurities in the air, the electrical performance is degraded due to the corrosion of the chip circuit, the protection of the chip surface, the connection leads and other fairly soft chips are not subject to external damage and external damage in terms of electrical or thermal physics, etc. environmental impact. In addition, packaging can match the thermal expansion coefficient of the chip with the thermal expansion coefficient of the frame or substrate, thereby alleviating the stress caused by external environmental changes such as heat and the stress caused by chip heating, thereby preventing chip damage and failure. According to heat dissipation requirements, the thinner the semiconductor package, the better, if the chip power consumption is greater than 2 watts, a heat sink or heat sink must be added to the package to improve the heat dissipation capability. On the other hand, packaged chips are also easier to mount and transport.

　　(2) Electrical connection. The package size adjustment (spacing conversion) function is adjusted from the very fine lead spacing of the chip to the size spacing of the mounting substrate, which is convenient for mounting operations. Encapsulation can act as a small-to-large, difficult, complex, and simple transformation, reducing operating and bill-of-material costs, and increasing productivity and reliability. In particular, cable length and impedance ratios are implemented to minimize connection resistance and minimize parasitic capacitance and inductance, thereby ensuring correct signal waveform and transmission speed.